Invention Grant
- Patent Title: Method for manufacturing an arrangement including a chip carrier notch
-
Application No.: US15607735Application Date: 2017-05-30
-
Publication No.: US10361138B2Publication Date: 2019-07-23
- Inventor: Michael Ledutke , Edward Fuergut
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/66 ; H01L21/56 ; H01L21/673
Abstract:
In various embodiments, an arrangement is provided. The arrangement may include a plurality of chips; a chip carrier carrying the plurality of chips, the chip carrier including a chip carrier notch; and encapsulation material encapsulating the chip carrier and filling the chip carrier notch; wherein the outer circumference of the encapsulation material is free from a recess.
Public/Granted literature
- US20170263480A1 ARRANGEMENT HAVING A PLURALITY OF CHIPS AND A CHIP CARRIER, AND A PROCESSING ARRANGEMENT Public/Granted day:2017-09-14
Information query
IPC分类:
