Invention Grant
- Patent Title: Optical modulator
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Application No.: US15755735Application Date: 2016-09-27
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Publication No.: US10365506B2Publication Date: 2019-07-30
- Inventor: Kei Katou , Toshio Kataoka , Junichiro Ichikawa
- Applicant: Sumitomo Osaka Cement Co., Ltd
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO OSAKA CEMENT CO., LTD
- Current Assignee: SUMITOMO OSAKA CEMENT CO., LTD
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2015-192597 20150930
- International Application: PCT/JP2016/078429 WO 20160927
- International Announcement: WO2017/057351 WO 20170406
- Main IPC: G02F1/01
- IPC: G02F1/01 ; H05K1/02 ; H05K1/14 ; H05K1/11

Abstract:
Provided is an optical modulator in which a phenomenon of a resonance mode or the like is prevented from being generated in a recess portion of a housing that mounts a flexible printed circuit and of which broadband characteristics are improved.There is provided an optical modulator in which an optical modulation element is mounted inside a housing, in which at least a portion of an electric line is connected to an external circuit board 7 through a flexible printed circuit 6, and which is disposed on the external circuit board. A recess portion (area indicated with a dotted line D) that mounts the flexible printed circuit is formed on an outer bottom surface of the housing and at a part where the flexible printed circuit is connected, and means for preventing a resonance mode or the like (for example, a corrugated shape 21) is provided such that a resonance mode of a microwave and a millimeter wave or a parallel plate mode is prevented from being generated among a surface A of the recess portion facing the flexible printed circuit, an electric wiring part B provided on the flexible printed circuit overlapping the surface A when seen in a plan view, an electric wiring part C provided on the external circuit board overlapping the surface A when seen in a plan view.
Public/Granted literature
- US20190025612A1 OPTICAL MODULATOR Public/Granted day:2019-01-24
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