Invention Grant
- Patent Title: Structure and method for flexible power staple insertion
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Application No.: US15962065Application Date: 2018-04-25
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Publication No.: US10366954B1Publication Date: 2019-07-30
- Inventor: Juhan Kim , Mahbub Rashed , Navneet Jain
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Gibb & Riley, LLC
- Agent David A. Cain, Esq.
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; G06F17/50 ; H01L27/02 ; H01L23/50

Abstract:
In an exemplary structure, a first conductor connects a power source to integrated circuit devices. The first conductor includes a first axis defining a first side and a second side. A second conductor, perpendicular to the first conductor, is connected to the first conductor by first vias. A third conductor, parallel to the first conductor, is connected to the second conductor by second vias. The third conductor includes a second axis defining a third side and a fourth side. The first side and the third side are aligned in a first plane perpendicular to the conductors and the second side and the fourth side are aligned in a second plane perpendicular to the conductors. The first vias contact the first conductor in only the first side. The second vias contact the third conductor in only the third side. And the second conductor is outside the second plane.
Information query
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