Invention Grant
- Patent Title: Resonator package and method of manufacturing the same
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Application No.: US15058713Application Date: 2016-03-02
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Publication No.: US10367471B2Publication Date: 2019-07-30
- Inventor: Tae Yoon Kim , Yeong Gyu Lee , Moon Chul Lee , Jae Chang Lee , Duck Hwan Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0070825 20150521; KR10-2015-0126960 20150908
- Main IPC: H03H9/10
- IPC: H03H9/10 ; H03H9/13 ; H03H3/02
Abstract:
A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.
Public/Granted literature
- US20160344367A1 RESONATOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-11-24
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