Invention Grant
- Patent Title: Process for producing bonded body and process for producing power module substrate
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Application No.: US15304544Application Date: 2015-04-16
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Publication No.: US10370303B2Publication Date: 2019-08-06
- Inventor: Nobuyuki Terasaki , Yoshiyuki Nagatomo
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2014-091955 20140425
- International Application: PCT/JP2015/061719 WO 20150416
- International Announcement: WO2015/163232 WO 20151029
- Main IPC: B23K1/00
- IPC: B23K1/00 ; C04B37/02 ; B23K1/19 ; B23K1/20 ; C22C9/00 ; C22C9/01 ; H01L23/40 ; B23K35/30 ; C22C9/02 ; B23K35/26 ; B23K35/28 ; C22C12/00 ; C22C13/00 ; C22C21/00 ; C22C24/00 ; C22C28/00
Abstract:
Disclosed is provided a process for producing a bonded body by bonding a ceramic member made of a ceramic to a Cu member made of Cu or a Cu alloy, the process including: a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material containing Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and a heating step of heating the ceramic member and the Cu member which are laminated together.
Public/Granted literature
- US20170044072A1 PROCESS FOR PRODUCING BONDED BODY AND PROCESS FOR PRODUCING POWER MODULE SUBSTRATE Public/Granted day:2017-02-16
Information query
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