An electronic unit is provided including a heat dissipating device having a projecting heat transfer portion, a substrate on one surface side of which the heat dissipating device is disposed and in which an opening portion where the heat transfer portion is inserted is formed, an electronic part disposed on the other surface side of the substrate so that a heat dissipating surface is positioned in the opening portion and connected to the substrate via a frame-shaped connecting portion disposed with a gap between the substrate and itself, and a heat conductive member provided between the heat transfer portion and the heat dissipating surface and between an outer circumference of the heat transfer portion and an inner circumference of the connecting portion, wherein an end portion of the heat conductive member is positioned closer to the heat dissipating device than the gap between the connecting portion and the substrate.