Invention Grant
- Patent Title: Semiconductor device, manufacturing method thereof, module, and electronic device
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Application No.: US15588085Application Date: 2017-05-05
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Publication No.: US10373981B2Publication Date: 2019-08-06
- Inventor: Shunpei Yamazaki , Kenichi Okazaki , Masataka Nakada , Masahiro Katayama
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2014-020620 20140205; JP2014-043637 20140306
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/24 ; H01L29/49 ; H01L29/51 ; H01L29/66 ; H01L49/02 ; H01L29/423 ; H01L29/786

Abstract:
A semiconductor device includes a transistor and a capacitor. The transistor includes a first conductive film; a first insulating film including a film containing hydrogen; a second insulating film including an oxide insulating film; an oxide semiconductor film including a first region and a pair of second regions; a pair of electrodes; a gate insulating film; and a second conductive film. The capacitor includes a lower electrode, an inter-electrode insulating film, and an upper electrode. The lower electrode contains the same material as the first conductive film. The inter-electrode insulating film includes a third insulating film containing the same material as the first insulating film and a fourth insulating film containing the same material as the gate insulating film. The upper electrode contains the same material as the second conductive film. A fifth insulating film containing hydrogen is provided over the transistor.
Public/Granted literature
- US20170236846A1 Semiconductor Device, Manufacturing Method Thereof, Module, and Electronic Device Public/Granted day:2017-08-17
Information query
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