Invention Grant
- Patent Title: Array substrate and method of mounting integrated circuit using the same
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Application No.: US15901846Application Date: 2018-02-21
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Publication No.: US10373987B2Publication Date: 2019-08-06
- Inventor: Dae Geun Lee
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2014-0073756 20140617
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H05K1/11 ; G02F1/1345 ; H01L23/00 ; H05K1/18 ; H01L27/32

Abstract:
An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.
Public/Granted literature
- US20180182781A1 ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME Public/Granted day:2018-06-28
Information query
IPC分类: