Invention Grant
- Patent Title: Multilayer electronic component and multilayer chip antenna including the same
-
Application No.: US15289581Application Date: 2016-10-10
-
Publication No.: US10374313B2Publication Date: 2019-08-06
- Inventor: Soon Kwang Kwon , Chang Ryul Jung , Jung Wook Seo , In Gyu Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2015-0188322 20151229
- Main IPC: H01Q7/06
- IPC: H01Q7/06 ; H01F27/255 ; H01F17/04 ; H01F17/00 ; H01F27/26 ; H01Q1/22

Abstract:
A multilayer electronic component includes a body and a coil. The body includes a plurality of sheets each containing magnetic powder particles. The coil includes an uppermost coil pattern disposed on a top surface of an uppermost sheet among the plurality of sheets, a lowermost coil pattern disposed on a bottom surface of a lowermost sheet among the plurality of sheets, and side coil patterns disposed on edges of central sheets disposed between the uppermost sheet and the lowermost sheet in a central portion of the body. The magnetic powder particles have shape anisotropy, and a major axes of the magnetic powder particles are aligned with each other within the body. A multilayer chip antenna can include the multilayer electronic component.
Public/Granted literature
- US20170186527A1 MULTILAYER ELECTRONIC COMPONENT AND MULTILAYER CHIP ANTENNA INCLUDING THE SAME Public/Granted day:2017-06-29
Information query