Invention Grant
- Patent Title: Semiconductor device for radio frequency switch, radio frequency switch, and radio frequency module
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Application No.: US15303072Application Date: 2015-03-25
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Publication No.: US10374596B2Publication Date: 2019-08-06
- Inventor: Atsushi Kuranouchi
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: CHIP
- Priority: JP2014-086804 20140418
- International Application: PCT/JP2015/059125 WO 20150325
- International Announcement: WO2015/159669 WO 20151022
- Main IPC: H03K17/16
- IPC: H03K17/16 ; H03K17/693 ; H01L27/12 ; H01L29/78

Abstract:
Provided is a semiconductor device for radio frequency switch that includes an SOI substrate and a gate electrode. The SOI substrate includes a buried oxide film and a semiconductor layer on a carrier substrate. The gate electrode is provided on the semiconductor layer. The semiconductor layer includes a first area below the gate electrode and a second area other than the first area. A third area is provided in at least part of the second area. A fourth area is provided in at least part of the first area. The fourth area has a different thickness from a thickness of the third area.
Public/Granted literature
- US20170033784A1 SEMICONDUCTOR DEVICE FOR RADIO FREQUENCY SWITCH, RADIO FREQUENCY SWITCH, AND RADIO FREQUENCY MODULE Public/Granted day:2017-02-02
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