• Patent Title: Semiconductor device for radio frequency switch, radio frequency switch, and radio frequency module
  • Application No.: US15303072
    Application Date: 2015-03-25
  • Publication No.: US10374596B2
    Publication Date: 2019-08-06
  • Inventor: Atsushi Kuranouchi
  • Applicant: SONY CORPORATION
  • Applicant Address: JP Tokyo
  • Assignee: SONY CORPORATION
  • Current Assignee: SONY CORPORATION
  • Current Assignee Address: JP Tokyo
  • Agency: CHIP
  • Priority: JP2014-086804 20140418
  • International Application: PCT/JP2015/059125 WO 20150325
  • International Announcement: WO2015/159669 WO 20151022
  • Main IPC: H03K17/16
  • IPC: H03K17/16 H03K17/693 H01L27/12 H01L29/78
Semiconductor device for radio frequency switch, radio frequency switch, and radio frequency module
Abstract:
Provided is a semiconductor device for radio frequency switch that includes an SOI substrate and a gate electrode. The SOI substrate includes a buried oxide film and a semiconductor layer on a carrier substrate. The gate electrode is provided on the semiconductor layer. The semiconductor layer includes a first area below the gate electrode and a second area other than the first area. A third area is provided in at least part of the second area. A fourth area is provided in at least part of the first area. The fourth area has a different thickness from a thickness of the third area.
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