发明授权
- 专利标题: Circuit board with return path separated low crosstalk via transition structure
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申请号: US15379994申请日: 2016-12-15
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公开(公告)号: US10375822B2公开(公告)日: 2019-08-06
- 发明人: Yuan Li , James R. Foppiano , Jonathan P. Dowling , Gerald J. Merits , Manjunath Shivappa , Wasim I. Ullah , Claude Hilbert
- 申请人: Advanced Micro Devices, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Advanced Micro Devices, Inc.
- 当前专利权人: Advanced Micro Devices, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理商 Timothy M. Honeycutt
- 主分类号: H01P3/08
- IPC分类号: H01P3/08 ; H05K1/02 ; H05K1/11 ; H05K3/40
摘要:
Various circuit boards and systems are disclosed. In one aspect a system includes a circuit board and n differential signal via pairs. Each of the n differential signal via pairs has a first signal via and a second signal via and an electrical wall between the first signal via and the second signal via. There is a midline between every two adjacent differential via pairs. There are n ground return path vias. Each of the n ground return path vias is positioned substantially along one of the midlines and not on one of the electrical walls.
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