A circuit member includes a metal base, an insulating layer, a conductor, and a cover layer. A termial portion of the circuit member includes a thick portion formed at a part of the insulating layer, a conductor convex portion which is a part of the conductor, and overlaps the thick portion, and a conductor extending portion. By the conductor convex portion and the conductor extending portion, a stepped side pad is formed. The stepped side gad includes a first surface along the conductor extending portion, and a second surface which rises in a thickness direction of the conductor extending portion. The stepped side pad and an element are connected by a conductive member.