Invention Grant
- Patent Title: Drive cover with overmold features for clamp assembly contact
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Application No.: US15808838Application Date: 2017-11-09
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Publication No.: US10381048B2Publication Date: 2019-08-13
- Inventor: Pow Ming Yap , Ying Su
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Main IPC: G11B33/08
- IPC: G11B33/08 ; G11B33/02 ; G11B33/14
Abstract:
The apparatus includes a drive base, a drive cover overlying the drive base, wherein the drive cover comprises an opening therein, and wherein the drive cover is coupled to the drive base to enclose a media within an interior of the apparatus. A snubber is overmolded onto the drive cover. A clamp assembly contacts the snubber during shock events.
Public/Granted literature
- US20190139581A1 DRIVE COVER WITH OVERMOLD FEATURES FOR CLAMP ASSEMBLY CONTACT Public/Granted day:2019-05-09
Information query
IPC分类:
