Invention Grant
- Patent Title: Semiconductor device with separation regions
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Application No.: US15858217Application Date: 2017-12-29
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Publication No.: US10381467B2Publication Date: 2019-08-13
- Inventor: Roman Baburske , Matteo Dainese , Peter Lechner , Hans-Joachim Schulze , Johannes Georg Laven
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L29/06 ; H01L29/10 ; H01L29/40 ; H01L29/66 ; H01L29/423 ; H01L29/739 ; H01L29/861

Abstract:
According to an embodiment of a semiconductor device, the device includes first and second trenches formed in a semiconductor body and an electrode disposed in each of the trenches. One of the electrodes is a gate electrode, and the other electrode is electrically disconnected from the gate electrode. The semiconductor device further includes a semiconductor mesa between the trenches. The semiconductor mesa includes a separation region and at least one of a source region and a body region located in the semiconductor mesa. A drift zone is provided below the at least one of the source region and the body region. In the separation region, at least one of (i) a capacitive coupling between the gate electrode and the semiconductor mesa and (ii) a conductivity of majority charge carriers of the drift zone is lower than outside of the separation region.
Public/Granted literature
- US20180145161A1 Semiconductor Device with Separation Regions Public/Granted day:2018-05-24
Information query
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