Invention Grant
- Patent Title: Heat transfer chassis and method for forming the same
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Application No.: US15222478Application Date: 2016-07-28
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Publication No.: US10383261B2Publication Date: 2019-08-13
- Inventor: Andrew Louis Krivonak , Theodore Clark Brown , Shreenath Shekar Perlaguri , Brian Magann Rush , Rajendra Yammanuru , Naveenan Thiagarajan , Arunpandi Radhakrishnan
- Applicant: General Electric Company
- Applicant Address: US CT Norwalk
- Assignee: GE GLOBAL SOURCING LLC
- Current Assignee: GE GLOBAL SOURCING LLC
- Current Assignee Address: US CT Norwalk
- Agency: The Small Patent Law Group LLC
- Agent Christopher R. Carroll
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/467 ; H01L23/473

Abstract:
A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.
Public/Granted literature
- US20170112018A1 HEAT TRANSFER CHASSIS AND METHOD FOR FORMING THE SAME Public/Granted day:2017-04-20
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