Invention Grant
- Patent Title: Coil component and circuit board including the same
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Application No.: US15852662Application Date: 2017-12-22
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Publication No.: US10388452B2Publication Date: 2019-08-20
- Inventor: Toshio Tomonari , Sachiko Takano , Shigeki Sato
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young Law Firm, P.C.
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/24 ; H05K1/18 ; H01F27/29 ; H01F27/32 ; H01F41/12 ; H05K1/02 ; H01F17/00 ; H05K1/11

Abstract:
Disclosed herein is a coil component that includes a coil conductor part, and first and second high permeability parts provided respectively on both sides of the coil conductor part in a coil axis direction. The second high permeability part has a larger thickness in the coil axis direction than the first high permeability part. A low permeability part that segments at least a part of a magnetic path exists between the first and second high permeability parts in an outer diameter area of the coil conductor part when viewed in the coil axis direction.
Public/Granted literature
- US20190006088A1 COIL COMPONENT AND CIRCUIT BOARD INCLUDING THE SAME Public/Granted day:2019-01-03
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