Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US15876969Application Date: 2018-01-22
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Publication No.: US10388459B2Publication Date: 2019-08-20
- Inventor: Gyoung Heon Ko , Young Jong Yoo , Jea Hoon Lee , Yeo Ju Cho
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2017-0043880 20170404; KR10-2017-0079430 20170623
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/228 ; H01G4/232 ; H01G4/005 ; H01G4/012 ; H01G4/12
Abstract:
A multilayer electronic component has a structure in which an internal electrode connected to a positive (+) terminal of a circuit and an internal electrode connected to a ground of the circuit are implemented together on one dielectric layer and external electrodes commonly use a multi-terminal connected to the ground of the circuit.
Public/Granted literature
- US20180286592A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2018-10-04
Information query
