- Patent Title: Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same
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Application No.: US15428963Application Date: 2017-02-09
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Publication No.: US10388537B2Publication Date: 2019-08-20
- Inventor: Chae Lyoung Kim , Tae-Hong Kim , Jung-Min Oh , Yungjun Kim , Ingi Kim , Boun Yoon , Hyosan Lee , Sol Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2016-0045909 20160415; KR10-2016-0094385 20160725
- Main IPC: B08B3/02
- IPC: B08B3/02 ; H01L21/306 ; B24B37/20 ; B24B53/017 ; H01L21/02 ; H01L21/67
Abstract:
A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.
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