Invention Grant
- Patent Title: Stacked image sensor and method of manufacturing the same
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Application No.: US15241660Application Date: 2016-08-19
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Publication No.: US10388701B2Publication Date: 2019-08-20
- Inventor: Sookyoung Roh , Seokho Yun , Sunghyun Nam
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sighrue Mion, PLLC
- Priority: KR10-2015-0116852 20150819
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/30 ; H01L31/028 ; H01L51/44 ; H01L31/0256
Abstract:
A stacked image sensor and a method of manufacturing the same are provided. The stacked image sensor includes a lower photoelectric conversion layer, a micro-lens provided on the lower photoelectric conversion layer, and an upper photoelectric conversion layer provided on the micro-lens. The lower photoelectric conversion layer and the upper photoelectric conversion layer are different types of photoelectric conversion layers.
Public/Granted literature
- US20170053969A1 STACKED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-02-23
Information query
IPC分类:
