Invention Grant
- Patent Title: 3D memory device and structure
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Application No.: US15452615Application Date: 2017-03-07
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Publication No.: US10388863B2Publication Date: 2019-08-20
- Inventor: Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist
- Applicant: Monolithic 3D Inc.
- Applicant Address: US CA San Jose
- Assignee: MONOLITHIC 3D INC.
- Current Assignee: MONOLITHIC 3D INC.
- Current Assignee Address: US CA San Jose
- Agency: Tran & Associates
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/762 ; H01L27/06 ; H01L27/11578 ; H01L27/24 ; H01L45/00

Abstract:
A 3D integrated circuit device, including: a first transistor; a second transistor; and a third transistor, where the third transistor is overlaying the second transistor and is controlled by a third control line, where the second transistor is overlaying the first transistor and is controlled by a second control line, where the first transistor is part of a control circuit controlling the second control line and third control line, and where the first transistor, the second transistor and the third transistor are all aligned to each other with less than 100 nm misalignment.
Public/Granted literature
- US20170179155A1 3D MEMORY DEVICE AND STRUCTURE Public/Granted day:2017-06-22
Information query
IPC分类: