An electronic component a multilayer body including insulation layers stacked in a stacking direction, a mounting surface that opposes a circuit board when the electronic component is mounted on the circuit board, first and second input/output terminals provided on the mounting surface and adjacent to each other, a ground terminal, a first filter circuit, in the multilayer body, electrically connected between the first input/output terminal and the second input/output terminal, and a ground conductor layer, provided between the first filter circuit and the mounting surface in the stacking direction, that overlaps with the first input/output terminal and the second input/output terminal when viewed in plan view from the stacking direction, and that is connected to the ground terminal.