An electronic device package includes a substrate, an electronic device, and a first packaging layer. The electronic device and the first packaging layer are disposed on the substrate and the electronic device is located between the substrate and the first packaging layer. The first packaging layer includes a first oxynitride layer and a second oxynitride layer, wherein the second oxynitride layer is located between the first oxynitride layer and the electronic device. A composition of the first oxynitride layer includes SiNx1Oy1, a composition of the second oxynitride layer includes SiNx2Oy2, and x1>x2.