- 专利标题: Semiconductor device
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申请号: US15918309申请日: 2018-03-12
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公开(公告)号: US10396549B2公开(公告)日: 2019-08-27
- 发明人: Masashi Arakawa , Tadashi Fukui , Koji Takayanagi
- 申请人: Renesas Electronics Corporation
- 申请人地址: JP Tokyo
- 专利权人: RENESAS ELECTRONICS CORPORATION
- 当前专利权人: RENESAS ELECTRONICS CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2014-198264 20140929
- 主分类号: H02H9/00
- IPC分类号: H02H9/00 ; H02H9/04 ; H01L27/02
摘要:
Provided is a semiconductor device making it possible to promote area reduction while maintaining ESD resistance. The semiconductor device includes a power wire, a ground wire and a protection circuit provided between the power wire and the ground wire so as to cope with electrostatic discharge. The protection circuit includes a first transistor, a first resistive element, a second transistor, a first capacitive element, a first inverter and a protection transistor. A gate width of the second transistor is narrower than a gate width of the first transistor.
公开/授权文献
- US20180205225A1 SEMICONDUCTOR DEVICE 公开/授权日:2018-07-19
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