Invention Grant
- Patent Title: Microelectromechanical microphone
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Application No.: US15876239Application Date: 2018-01-22
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Publication No.: US10397709B2Publication Date: 2019-08-27
- Inventor: Alfons Dehe
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Priority: DE102017101195 20170123
- Main IPC: H04R9/00
- IPC: H04R9/00 ; H04R29/00 ; H04R19/04 ; H04R7/12 ; H04R7/18 ; H04R7/20 ; B81B3/00 ; H04R19/00 ; H04R7/24

Abstract:
A microelectromechanical microphone includes a planar first electrode that is formed, at least in portions, from an electrically conductive material, a planar second electrode that is formed, at least in portions, from an electrically conductive material and that is arranged at a distance from the first electrode, a spacer that is arranged between the first electrode and the second electrode, and a membrane that is arranged in a space defined between the first electrode and the second electrode and that is displaceable in the direction of at least one of the first electrode or the second electrode. The membrane has a membrane passage opening through which the spacer extends. The space defined between the first and the second electrode, in which the membrane is arranged, has a gas exchange connection with the surroundings of the microphone.
Public/Granted literature
- US20180213334A1 MICROELECTROMECHANICAL MICROPHONE Public/Granted day:2018-07-26
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