Invention Grant
- Patent Title: Vibration diaphragm and manufacturing method thereof
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Application No.: US16084479Application Date: 2016-05-24
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Publication No.: US10397718B2Publication Date: 2019-08-27
- Inventor: Guodong Zhao , Pengcheng Ji , Xinfeng Yang
- Applicant: GOERTEK INC.
- Applicant Address: CN Weifang, Shandong
- Assignee: GOERTEK INC.
- Current Assignee: GOERTEK INC.
- Current Assignee Address: CN Weifang, Shandong
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: CN201610160789 20160321
- International Application: PCT/CN2016/083090 WO 20160524
- International Announcement: WO2017/161668 WO 20170928
- Main IPC: H04R7/06
- IPC: H04R7/06 ; H04R31/00 ; H04R3/00 ; H04R7/16 ; H04R7/18 ; H04R9/06

Abstract:
A vibration diaphragm and a manufacturing method thereof are provided. The vibration diaphragm comprises an annular support member, a first vibration diaphragm layer and a circuit layer. The first vibration diaphragm layer is fixedly connected to a support body of the annular support member. The circuit layer is positioned on a surface of the first vibration diaphragm layer that is adjacent to a vibrating voice coil and is fixedly connected to the first vibration diaphragm layer and the support body. The circuit layer is provided with a circuit area, a capacitance area, and a capacitance solder pad. The capacitance area is a capacitance electrode plate formed on the first vibration diaphragm layer. The capacitance area is communicated with the capacitance solder pad by means of the circuit area. The solder pad corresponds to the support body. The reliability of capacitance data acquisition is improved.
Public/Granted literature
- US20190075416A1 VIBRATION DIAPHRAGM AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-03-07
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