Invention Grant
- Patent Title: Heat pump and flow path switching apparatus
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Application No.: US14337674Application Date: 2014-07-22
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Publication No.: US10401064B2Publication Date: 2019-09-03
- Inventor: Suk Ho Lee , Il Yong Cho , Hyung Mo Koo , Min Chang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: KR10-2013-0088069 20130725
- Main IPC: F25B41/04
- IPC: F25B41/04 ; F25B13/00 ; F25B30/02

Abstract:
A heat pump performs a simultaneous air-conditioning and heating operation through the addition of a flow path switching apparatus. The heat pump may include a plurality of outdoor units, a plurality of indoor units, and a plurality of flow path switching apparatuses that switch a flow path between an outdoor unit and an indoor unit. A refrigerant flow path may be formed from the outdoor unit to the indoor unit via a high-pressure gas pipe. The flow path switching apparatuses may switch a flow path so that a refrigerant flow path is formed from the indoor unit to the outdoor unit via a low-pressure gas pipe. The heat pump may further include an indoor unit mode controller that is connected to the plurality of outdoor units through a liquid pipe, and which is connected to each of the plurality of flow path switching apparatuses.
Public/Granted literature
- US20150027154A1 HEAT PUMP AND FLOW PATH SWITCHING APPARATUS Public/Granted day:2015-01-29
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