Invention Grant
- Patent Title: Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography
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Application No.: US15711937Application Date: 2017-09-21
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Publication No.: US10403618B2Publication Date: 2019-09-03
- Inventor: Chandra S. Tiwari , Tony M. Lindenberg , Jonathan S. Hacker , Christopher J. Gambee , Kurt J. Bossart
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Parsons Behle & Latimer
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L23/00 ; H01L21/02
Abstract:
A semiconductor device assembly that includes a first side of a semiconductor device supported on a substrate to permit the processing of a second side of the semiconductor device. A filler material deposited on the semiconductor device supports the semiconductor device on the substrate. The filler material does not adhere to the semiconductor device or the substrate. Alternatively, the filler material may be deposited on the substrate. Instead of a filler material, the substrate may include a topography configured to support the semiconductor device. Adhesive applied between an outer edge of the first side of the semiconductor and the substrate bonds the outer edge of the semiconductor device to the substrate to form a semiconductor device assembly. A second side of the semiconductor device may then be processed and the outer edge of the semiconductor device may be cut off to release the semiconductor device from the assembly.
Public/Granted literature
Information query
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