Examples of this disclosure include a low profile inductor for use in any application with a multi-layer inductor pattern that allows control of optimum H values. Some examples of such an inductive device comprises a plurality of patterned metal coils arranged in a vertical stack, a plurality of conductive vias configured to couple each of the plurality of patterned metal coils together, and a magnetic material disposed between the plurality of patterned metal coils and within each of the plurality of patterned metal coils.