Invention Grant
- Patent Title: Light emitting diode assembly using thermal pyrolytic graphite for thermal management
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Application No.: US15572522Application Date: 2016-05-13
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Publication No.: US10403806B2Publication Date: 2019-09-03
- Inventor: Wei Fan , Eelco Galestien , Creighton Tomek , Manjunath Subbanna
- Applicant: Momentive Performance Materials Inc.
- Applicant Address: US NY Waterford
- Assignee: Momentive Performance Materials Inc.
- Current Assignee: Momentive Performance Materials Inc.
- Current Assignee Address: US NY Waterford
- Agency: McDonald Hopkins LLC
- Agent Joseph Waters
- International Application: PCT/US2016/032269 WO 20160513
- International Announcement: WO2016/186985 WO 20161124
- Main IPC: H01L33/64
- IPC: H01L33/64 ; H01L23/373 ; F21V29/87 ; F21S41/141 ; F21S45/47 ; F21S41/148 ; F21Y101/00 ; F21Y115/10 ; F21Y107/90
Abstract:
A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a light emitting diode in thermal contact with a heat spreader. The heat spreader may comprise a core and/or fins. The core and/or fins comprise a thermal pyrolytic graphite material. The thermal management assembly comprising the core and/or fins can dissipate heat from the light emitting diode.
Public/Granted literature
- US20180159008A1 LIGHT EMITTING DIODE ASSEMBLY USING THERMAL PYROLYTIC GRAPHITE FOR THERMAL MANAGEMENT Public/Granted day:2018-06-07
Information query
IPC分类:
