Invention Grant
- Patent Title: Connection structure of plate shaped routing material and electric connection box
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Application No.: US16204598Application Date: 2018-11-29
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Publication No.: US10404011B2Publication Date: 2019-09-03
- Inventor: Masahito Ozaki
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2017-231808 20171201
- Main IPC: H02B1/04
- IPC: H02B1/04 ; H01R13/631 ; H01R13/621 ; H01R13/03

Abstract:
A connection structure of a plate shaped routing material and an electric connection box, includes a plate shaped routing material, an electric connection box, and a connection mechanism. The plate shaped routing material includes a belt like flat shaped conductor in which an outer surface is covered with an insulating coating, a connecting cut-out part in which a part of an edge part in one long side part is removed in a rectangular shape, a conductor piece part exposed from the insulating coating in the connecting cut-out part, and a cut-out edge part.
Public/Granted literature
- US20190173228A1 Connection Structure of Plate Shaped Routing Material and Electric Connection Box Public/Granted day:2019-06-06
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