Invention Grant
- Patent Title: EMI reduction within a connector using a feed-through capacitor
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Application No.: US15638877Application Date: 2017-06-30
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Publication No.: US10404229B2Publication Date: 2019-09-03
- Inventor: Shi Man Li , Chi Tsung Yang , Chien Chung Lee
- Applicant: CommScope Technologies LLC
- Applicant Address: US NC Hickory
- Assignee: CommScope Technologies LLC
- Current Assignee: CommScope Technologies LLC
- Current Assignee Address: US NC Hickory
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H03H1/00
- IPC: H03H1/00 ; H01R24/00 ; H01R13/719 ; A61N1/375 ; H01G4/35 ; H01R13/7195 ; H01R13/658 ; H01R24/42 ; H01R13/52 ; H01R13/66 ; H01R24/52 ; H01R24/54

Abstract:
An EMI filtering, coaxial power connector may be formed as an inline component or a port of a device. The connector may have dimensions to accept F-type coaxial connectors. The connector includes a conductive outer shell with a first opening and a second opening. A dielectric member is disposed within the shell. A conductive pin is supported by the dielectric member. A feed-through capacitor has a central opening and a first lead formed within the central opening. The pin is electrically connected to the first lead. A second lead of the capacitor is formed at an outer perimeter of the capacitor and is electrically connected to the shell. A metal plate is mounted within the shell. The plate is disk-shaped with a central hole. An outer perimeter of the plate is in electrical contact with the shell. The pin passes through the central hole without making electrical contact with the plate, and the plate resides between the second opening of the shell and the capacitor.
Public/Granted literature
- US20180013245A1 EMI REDUCTION WITHIN A CONNECTOR USING A FEED-THROUGH CAPACITOR Public/Granted day:2018-01-11
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