In an example, a process for bonding a microcapsule having an encapsulating payload to a polymeric material. The process includes applying a microcapsule (having the encapsulated payload) that includes a dienophile functional group to a polymeric material that includes a diene functional group. The process further includes bonding the microcapsule having the encapsulated payload to the polymeric material via a chemical reaction of the dienophile functional group with the diene functional group.