Invention Grant
- Patent Title: Integrated cantilever switch
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Application No.: US15892028Application Date: 2018-02-08
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Publication No.: US10411140B2Publication Date: 2019-09-10
- Inventor: Qing Liu , John H. Zhang
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: US TX Coppell
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Coppell
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: B81B7/02
- IPC: B81B7/02 ; H01L29/84 ; H01H59/00 ; B82B3/00 ; H01H1/00 ; H01H49/00 ; H01L21/02 ; H01L21/306 ; H01H50/00

Abstract:
An integrated transistor in the form of a nanoscale electromechanical switch eliminates CMOS current leakage and increases switching speed. The nanoscale electromechanical switch features a semiconducting cantilever that extends from a portion of the substrate into a cavity. The cantilever flexes in response to a voltage applied to the transistor gate thus forming a conducting channel underneath the gate. When the device is off, the cantilever returns to its resting position. Such motion of the cantilever breaks the circuit, restoring a void underneath the gate that blocks current flow, thus solving the problem of leakage. Fabrication of the nano-electromechanical switch is compatible with existing CMOS transistor fabrication processes. By doping the cantilever and using a back bias and a metallic cantilever tip, sensitivity of the switch can be further improved. A footprint of the nano-electromechanical switch can be as small as 0.1×0.1 μm2.
Public/Granted literature
- US20180182902A1 INTEGRATED CANTILEVER SWITCH Public/Granted day:2018-06-28
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