Invention Grant
- Patent Title: Debris bundling device
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Application No.: US15808875Application Date: 2017-11-09
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Publication No.: US10421606B2Publication Date: 2019-09-24
- Inventor: Sounthaly Outhavong
- Applicant: Sounthaly Outhavong
- Agency: Cesari & Reed LLP
- Agent R. Michael Reed
- Main IPC: B32B3/08
- IPC: B32B3/08 ; B65F1/00 ; B32B7/12 ; B32B3/26

Abstract:
In some embodiments, a debris bundling device can include a substrate including at least one edge. The substrate may be formed from a flexible material. The debris bundling device may further include a plurality of strings and a plurality of fasteners coupled to the substrate. Each string may include a first end coupled to the substrate and may include a second end. Each fastener may be configured to engage the second end of one of the plurality of strings to secure the substrate in a wrapped state.
Public/Granted literature
- US20180222671A1 Debris Bundling Device Public/Granted day:2018-08-09
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