- 专利标题: Cover having metallic grid structure and method for manufacturing the cover
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申请号: US13907615申请日: 2013-05-31
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公开(公告)号: US10424765B2公开(公告)日: 2019-09-24
- 发明人: Yong-Wook Hwang , Sung-Ho Cho , Hee-Cheul Moon , Seung-Chang Baek , Chan-Seob Park
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2012-0058821 20120531
- 主分类号: H01M2/04
- IPC分类号: H01M2/04 ; H04M1/02 ; B29C45/14 ; B29L31/34 ; H01Q1/24 ; H01Q1/42 ; H01Q15/00
摘要:
Provided are a cover having a metallic grid structure and a method for manufacturing the cover. The cover includes a pattern portion formed of a metallic material, in which a plurality of patterns are independently disposed spaced apart from each other and an injection portion disposed between pattern portions to connect the pattern portions, the injection portion being formed of a non-metallic material. The method includes forming a pre-pattern portion including patterns in a regular or irregular form and a bridge connecting the patterns on a metallic plate, forming the injection portion on the pre-pattern portion by insert-injection or thermo-compression press, and removing the bridge.
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