Invention Grant
- Patent Title: Cover having metallic grid structure and method for manufacturing the cover
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Application No.: US13907615Application Date: 2013-05-31
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Publication No.: US10424765B2Publication Date: 2019-09-24
- Inventor: Yong-Wook Hwang , Sung-Ho Cho , Hee-Cheul Moon , Seung-Chang Baek , Chan-Seob Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2012-0058821 20120531
- Main IPC: H01M2/04
- IPC: H01M2/04 ; H04M1/02 ; B29C45/14 ; B29L31/34 ; H01Q1/24 ; H01Q1/42 ; H01Q15/00

Abstract:
Provided are a cover having a metallic grid structure and a method for manufacturing the cover. The cover includes a pattern portion formed of a metallic material, in which a plurality of patterns are independently disposed spaced apart from each other and an injection portion disposed between pattern portions to connect the pattern portions, the injection portion being formed of a non-metallic material. The method includes forming a pre-pattern portion including patterns in a regular or irregular form and a bridge connecting the patterns on a metallic plate, forming the injection portion on the pre-pattern portion by insert-injection or thermo-compression press, and removing the bridge.
Public/Granted literature
- US20130323579A1 COVER HAVING METALLIC GRID STRUCTURE AND METHOD FOR MANUFACTURING THE COVER Public/Granted day:2013-12-05
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