Invention Grant
- Patent Title: Method and apparatus for obtaining elasticity information about region of interest by using shear wave
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Application No.: US14293425Application Date: 2014-06-02
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Publication No.: US10426439B2Publication Date: 2019-10-01
- Inventor: Dong-geon Kong , Jun-ho Park , Ji-young Park , Hyoung-ki Lee , Ki-wan Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: KR10-2013-0157531 20131217
- Main IPC: A61B8/14
- IPC: A61B8/14 ; A61B8/08 ; G01S7/52 ; G01S15/89

Abstract:
A probe irradiates an ultrasound wave to an object to induce a shear wave and first elasticity information is obtained according to a first calculating scheme. An internal region of interest of the object is set based on shear modulus values included in the first elasticity information. Second elasticity information is obtained based on the shear wave induced to the internal region of interest, according to a second calculating scheme. Accurate elasticity information is acquired by using the first and second elasticity information to obtain third elasticity information from which an elastography image is generated for display to a user.
Public/Granted literature
- US20150164476A1 METHOD AND APPARATUS FOR OBTAINING ELASTICITY INFORMATION ABOUT REGION OF INTEREST BY USING SHEAR WAVE Public/Granted day:2015-06-18
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