- 专利标题: Test circuit, test method, array substrate and manufacturing method thereof
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申请号: US15841911申请日: 2017-12-14
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公开(公告)号: US10429412B2公开(公告)日: 2019-10-01
- 发明人: Yucheng Chan , Dong Li , Bin Zhang
- 申请人: BOE Technology Group Co., Ltd.
- 申请人地址: CN Beijing
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址: CN Beijing
- 代理机构: Fay Sharpe LLP
- 优先权: CN201710210639 20170331
- 主分类号: G01R1/04
- IPC分类号: G01R1/04 ; G01R31/317 ; G01R31/26 ; G01R3/00
摘要:
A test circuit, a test method, an array substrate and a manufacturing method thereof are provided. The test circuit includes a plurality of to-be-tested units and plurality of test electrodes connected to the to-be-tested units. The plurality of to-be-tested units are arranged in a matrix. At least one of the test electrodes is multiplexed by the plurality of to-be-tested units in a row direction and at least one of the test electrodes is multiplexed by the plurality of to-be-tested units in a column direction.
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