A method of making a plurality of packaged semiconductor devices. The method includes providing a carrier blank having a die receiving surface and an underside. The method also includes mounting a plurality of semiconductor dies on the die receiving surface, wherein the dies extend to a first height above the die receiving surface. The method further includes depositing an encapsulant on the die receiving surface, wherein an upper surface of the encapsulant is located above said first height. The method also includes singulating to form the plurality of packaged semiconductor devices by sawing into the underside, through the carrier blank and partially through the encapsulant to a depth intermediate the first height and the upper surface, wherein said sawing separates the carrier blank into a plurality of carriers, and removing encapsulant from the upper surface of the encapsulant at least until said saw depth is reached.