Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15391888Application Date: 2016-12-28
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Publication No.: US10431680B2Publication Date: 2019-10-01
- Inventor: Sungsam Lee , Junsoo Kim , Hyoshin Ahn , Satoru Yamada , Joohyun Jeon , MoonYoung Jeong , Chunhyung Chung , Min Hee Cho , Kyo-Suk Chae , Eunae Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2016-0021242 20160223
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/04

Abstract:
A semiconductor device including a semiconductor substrate including a trench, the semiconductor substrate having a crystal structure; and an insulating layer covering an inner sidewall of the trench, wherein the inner sidewall of the trench has at least one plane included in a {320} family of planes of the crystal structure or at least one plane similar to the {320} family of planes.
Public/Granted literature
- US20170243973A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-08-24
Information query
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