Invention Grant
- Patent Title: CPU socket contact for improving bandwidth throughput
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Application No.: US15721358Application Date: 2017-09-29
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Publication No.: US10431912B2Publication Date: 2019-10-01
- Inventor: Gregorio R. Murtagian , Zhichao Zhang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/70 ; H01R13/24 ; H01R13/646 ; H01R13/6474 ; H01R43/16

Abstract:
High-speed data transmissions through a CPU socket are facilitated with CPU socket contacts that have a CPU socket contact body that improves bandwidth throughput. The CPU socket contact body is partially suspended from a CPU socket contact and may include a cavity. The CPU socket contact body includes capacitive impedance that substantially cancels an inductive impedance of the CPU socket contact. Canceling the inductive impedance causes the CPU socket contact to operate like an impedance-matched coaxial transmission line, which enables better bandwidth throughput than a non-impedance matched transmission line.
Public/Granted literature
- US20190103687A1 CPU SOCKET CONTACT FOR IMPROVING BANDWIDTH THROUGHPUT Public/Granted day:2019-04-04
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