Invention Grant
- Patent Title: Circuit arrangement, mobile device and method for amplifying a signal
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Application No.: US15758736Application Date: 2015-09-25
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Publication No.: US10432160B2Publication Date: 2019-10-01
- Inventor: Jee Hyun Kim , Prabin Kumar Pandey , Yubao Li , Gunnar Nitsche
- Applicant: Intel IP Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel IP Corporation
- Current Assignee: Intel IP Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Viering, Jentschura & Partner MBB
- International Application: PCT/CN2015/090662 WO 20150925
- International Announcement: WO2017/049563 WO 20170330
- Main IPC: H03G3/30
- IPC: H03G3/30 ; H04B1/16 ; H04B17/318 ; H03F3/19

Abstract:
A circuit may include at least one amplifier circuit configured to amplify a received signal having a first signal received in a first time interval and a second signal received in a second time interval. The first signal and the second signal are signals sent by a different number of coherent wireless signal sources. The circuit arrangement may further include at least one gain control circuit connected to the at least one amplifier circuit and configured to determine a first expected received signal strength of the first signal, to determine a second expected received signal strength of the second signal, and to determine a gain level based on the first and second expected received signal strengths. The at least one amplifier circuit may be configured to amplify the first signal using the determined gain level and to amplify the second signal using the determined gain level.
Public/Granted literature
- US20180302052A1 CIRCUIT ARRANGEMENT, MOBILE DEVICE AND METHOD FOR AMPLIFYING A SIGNAL Public/Granted day:2018-10-18
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