- Patent Title: Fastenerless hinge which enables thin form factor low cost design
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Application No.: US15609010Application Date: 2017-05-31
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Publication No.: US10435932B2Publication Date: 2019-10-08
- Inventor: Mark E. Sprenger , Kenan Arik , Drew G. Damm
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: E05D7/10
- IPC: E05D7/10 ; G06F1/16

Abstract:
The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously, a hinge system consistent with the present disclosure does not include fasteners such that the “Z” height of the computing device may be minimized in addition to reducing costs.
Public/Granted literature
- US20170260786A1 Fastenerless Hinge which Enables Thin Form Factor Low Cost Design Public/Granted day:2017-09-14
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