Invention Grant
- Patent Title: Low heat transfer encapsulation for high sensitivity and low power environmental sensing applications
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Application No.: US16048139Application Date: 2018-07-27
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Publication No.: US10436731B2Publication Date: 2019-10-08
- Inventor: Paulo S. Motta , Roberto M. Ribeiro , Richard Yeh
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: G01N27/12
- IPC: G01N27/12 ; B81B7/00

Abstract:
A miniature gas sensing device includes a silicon-based substrate including an opening. A first membrane is formed over the silicon-based substrate and a first portion of the first membrane covers the opening. A gas sensing layer is formed over a number of electrodes disposed over a first surface of the first portion of the first membrane and one or more heating elements. A permeable enclosure encapsulating the gas sensing layer can maintain thermal energy density over the gas sensing layer at a level sufficient to destroy a target gas to allow measuring a zero baseline.
Public/Granted literature
- US20190033242A1 LOW HEAT TRANSFER ENCAPSULATION FOR HIGH SENSITIVITY AND LOW POWER ENVIRONMENTAL SENSING APPLICATIONS Public/Granted day:2019-01-31
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