Invention Grant
- Patent Title: Circuit packages comprising epoxy mold compounds and methods of compression molding
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Application No.: US15745743Application Date: 2015-08-21
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Publication No.: US10438864B2Publication Date: 2019-10-08
- Inventor: Chien-Hua Chen , Michael W. Cumbie , Stephen Farrar
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2015/046265 WO 20150821
- International Announcement: WO2017/034515 WO 20170302
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/48 ; H01L23/373 ; H01L23/31 ; B41J2/16 ; B41J2/155
Abstract:
A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.
Public/Granted literature
- US20180226316A1 Circuit Package Public/Granted day:2018-08-09
Information query
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