Invention Grant
- Patent Title: Cuts in a circuit board
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Application No.: US15660612Application Date: 2017-07-26
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Publication No.: US10439307B2Publication Date: 2019-10-08
- Inventor: James D. Hensley , David G. Rohrer , Brent A. Ford
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R12/71 ; H05K1/02 ; H05K7/20 ; H05K1/14 ; H05K3/30 ; H01R12/72

Abstract:
Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.
Public/Granted literature
- US20190036248A1 CUTS IN A CIRCUIT BOARD Public/Granted day:2019-01-31
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