- 专利标题: Substrate assembly, display substrate motherboard, display substrate, and production method, display
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申请号: US15716305申请日: 2017-09-26
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公开(公告)号: US10440820B2公开(公告)日: 2019-10-08
- 发明人: Wenbin Jia , Li Sun , Minghung Hsu
- 申请人: BOE TECHNOLOGY GROUP CO., LTD. , HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- 申请人地址: CN Beijing CN Hefei, Anhui
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- 当前专利权人地址: CN Beijing CN Hefei, Anhui
- 代理机构: Kinney & Lange, P.A.
- 优先权: CN201611238294 20161228
- 主分类号: H05K1/03
- IPC分类号: H05K1/03 ; H05K1/18 ; H05K1/05 ; H01L51/00 ; H01L51/52 ; H01L27/32 ; H05K3/00
摘要:
Embodiments of this disclosure provide a substrate assembly, a display substrate motherboard, a display substrate, and a production method, and a display, and relate to the technical field of flexible display. The damage of the support substrate and the flexible base substrate upon separation may be avoided, and the bulging phenomenon of the connecting layer occurred at a high temperature may be prevented. This substrate assembly comprises a support substrate as well as a connecting layer and a flexible base substrate which are sequentially formed on the support substrate, wherein the material of the connecting layer comprises an organic layered material, and the molecule constituting the organic layered material comprises a hydrophilic group. The substrate assembly is used for producing a flexible display substrate.
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