Invention Grant
- Patent Title: Semiconductor integrated circuit cards and communication systems including the same
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Application No.: US15793469Application Date: 2017-10-25
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Publication No.: US10445024B2Publication Date: 2019-10-15
- Inventor: Hui-Kwon Seo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2016-0182372 20161229
- Main IPC: G06F3/06
- IPC: G06F3/06 ; H01L27/02 ; H01L23/498 ; H04B1/401 ; H01L23/50 ; H01L27/11526 ; H04B1/3816
Abstract:
A semiconductor integrated card includes an external package, a subscriber identification module (SIM) circuit, a plurality of SIM pins, a storage device and a plurality of memory pins. The SIM circuit is formed inside of the external package and is configured to store subscriber information. The SIM pins are formed on a surface of the external package and are electrically connected to the SIM circuit. The storage device is formed inside of the external package and is separated from the SIM circuit. The storage device includes a nonvolatile memory device. The memory pins are formed on the surface of the external package and are electrically connected to the storage device.
Public/Granted literature
- US20180189002A1 SEMICONDUCTOR INTEGRATED CIRCUIT CARDS AND COMMUNICATION SYSTEMS INCLUDING THE SAME Public/Granted day:2018-07-05
Information query
