Invention Grant
- Patent Title: Method for attaching wiring protective film layer, wiring structure and display panel
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Application No.: US15745815Application Date: 2017-06-22
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Publication No.: US10446413B2Publication Date: 2019-10-15
- Inventor: Mu Zeng , Tao Wang , Zhouping Wang , Guowen Yang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , Chengdu BOE Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Beijing CN Chengdu, Sichuan
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Chengdu, Sichuan
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg
- Priority: CN201610516113 20160701
- International Application: PCT/CN2017/089525 WO 20170622
- International Announcement: WO2018/001162 WO 20180104
- Main IPC: H01L21/56
- IPC: H01L21/56 ; G02F1/1362 ; H01L23/498 ; H01L23/552 ; H01L27/32 ; G02F1/1345

Abstract:
The present disclosure provides a method for attaching a wiring protective film layer, a wiring structure and a display panel. The attaching method comprises: forming a protective structure comprising a protective film layer and a carrier layer disposed in stack on a wiring layer, wherein the wiring layer and the protective film layer are in contact; and removing the carrier layer and remaining the protective film layer.
Public/Granted literature
- US20180211847A1 Method for Attaching Wiring Protective Film Layer, Wiring Structure and Display Panel Public/Granted day:2018-07-26
Information query
IPC分类: