Invention Grant
- Patent Title: Compact ejectable component assemblies in electronic devices
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Application No.: US15844369Application Date: 2017-12-15
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Publication No.: US10447324B2Publication Date: 2019-10-15
- Inventor: Scott A. Myers , Erik L Wang , Jason S. Sloey
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H04B1/3818
- IPC: H04B1/3818 ; H04M1/02 ; G06K13/08 ; H04B1/3816 ; H05K5/02

Abstract:
Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.
Public/Granted literature
- US20180115336A1 COMPACT EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES Public/Granted day:2018-04-26
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